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Ultra High Resolution 3D Inspection Addresses the Most Challenging Semiconductor Requirements
How do we accomplish this?
We are not telling the whole story, keeping a few secrets under lock and key, but let us reveal the following:
We are using a movable detector and sample to acquire multiple high-quality images. The reconstruction engine then reconstructs the volume containing the area of interest. Depending on the inspection task, the volume is sliced into multiple horizontal and vertical inspection layers. Then, each of these layers is inspected individually using highly sophisticated algorithms. Using this advanced capability, we are drastically reducing the inspection time and cycle times, plus we have a larger FOV for better coverage. Additionally. we have reduced the system complexity, amended the MIPS software shell, and reduced the radiation dose for all of the components.
