SEMICON Europa 2024: Innovations in Advanced Packaging and Fab Management

MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

 

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growt." - Laith Altimime, President of SEMI Europe

"SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." - Laith Altimime

Advanced Packaging Conference ─ 

Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The Role of Chiplets in Enhancing Performance and Efficiency
• Power Optimization Techniques for Next-Generation Applications
• Advances in Miniaturization and Material Integration
• Innovations in Heat Dissipation and Thermal Management
• Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─

Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

• Key Strategies in a Global Market Landscape
• Advancing Smart Manufacturing Solutions
• Europe's Environmental Transition: Stability to Sustainability
• Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

• CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.
• Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

• Platinum: 
  Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck, Schneider Electric, Siemens, Soitec, SUSS MicroTec and Tokyo Electron Europe (TEL) 
• Gold: 
  Exyte, KLA and Synopsys 
• Silver: 
  Adeia, EBARA, HCLTech, Honeywell, Kanken and Semilab 
• Event:
  ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EV Group (EVG), Flexciton, Fluor, IBM, imec, Lynceus, SCREEN, and Watlow 

About SEMI

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  mdperez@semi.org 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: sbahou@semi.org